Dai Yanwei

Personal profile

Name: Yanwei Dai

Gender: Male

Degrees: Ph.D.

Title: Lecturer

E-mail: ywdai@bjut.edu.cn

Current Professional Societies:

Member of Chinese Society of Theoretical and Applied Mechanics

 

Research Areas:

1. Characterizations of advanced electronics packaging materials;

2. Reliability assessment of advanced electronics packaging;

3. Fracture mechanics and structural integrity assessment under high temperature.

Honors

1. Selected in Talent Lift Program of Young Scholars by Beijing Association for Science and Technology;

Publications

  1. Dai YW, Liu YH, Qin F, Chao YJ, Chen HF. Constraint modified time dependent failure assessment diagram (TDFAD) based on C(t)-A2(t) theory for creep crack. International Journal of Mechanical Sciences, 2020, 165: 105193.

  2. Dai YW, Liu YH, Qin F, Chao YJ, Qian GA. C (t) dominance of the mixed I/II creep crack: Part II. Extensive creep. Theoretical and Applied Fracture Mechanics, 2020, 106: 102489.

  3. Dai YW, Liu YH, Qin F, Chao YJ, Berto F. Estimation of stress field for sharp V-notch in power-law creeping solids: An asymptotic viewpoint. International Journal of Solids and Structures, 2019, 180-181: 189-204.

  4. Dai YW, Liu YH, Qin F, Qian GA, Chao YJ. C (t) dominance of the mixed I/II creep crack: Part I. Transient creep. Theoretical and Applied Fracture Mechanics, 2019, 103: 102314.

  5. Dai YW, Liu YH, Qin F, Chao YJ. A unified method to solve higher order asymptotic crack-tip fields of mode I, mode II and mixed mode I/II crack in power-law creeping solids. Engineering Fracture Mechanics, 2019, 218: 106610.

  6. Dai YW, Liu YH, Qin F, Chao YJ. Notch stress intensity factor and C-integral evaluation for sharp V-notch in power-law creeping solids. Engineering Fracture Mechanics, 2019, 222: 106709.

  7. Fei Qin, Yuankun Hu, Yanwei Dai, Tong An, Pei Chen, Evaluation of thermal conductivity for sintered silver considering aging eect with microstructure based model, Microelectronics Reliability, 2020, 108: 113633.

  8. Qin F, Zhang M, Dai YW, Chen P, An T, He HW, Zhang H, Zheng JT. Optimization of TSV interconnects and BEOL layers under annealing process through fracture evaluation. Fatigue & Fracture of Engineering Materials & Structures. 2020; 1–12. DOI:10.1111/ffe.13206.

  9. Qin F, Zhao S, Dai YW, Yang MK, Xiang M, Yu DQ. Study of warpage evolution and control for six-side molded WLCSP in different packaging processes. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2020,10(4)730-738.

  10. Dai YW, Zhang M, Qin F, Chen P, An T. Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading. Engineering Fracture Mechanics, 2019, 209, 274-300.

  11. Dai YW, Liu YH, Chen HF. Numerical investigations on the effects of T-stress in mode I creep crack. International Journal of Computational Methods, 2018, 16(08), 1841002.

  12. Dai YW, Liu YH, Chao YJ. Higher order asymptotic analysis of crack tip fields under mode II creeping conditions. International Journal of Solids and Structures, 2017, 125, 89-107.

  13. Dai YW, Liu DH, Liu YH. Mismatch constraint effect of creep crack with modified boundary layer model. Journal of Applied Mechanics-Transactions of the ASME, 2016, 83(3), 031008.

  14. Dai YW, Liu YH, Chen HF, Liu DH. The interacting effect for collinear cracks near mismatching bimaterial interface under elastic creep. Journal of Pressure Vessel Technology-Transactions of the ASME, 2016, 138(4), 041404.

 

Personal Statement

Yanwei Dai received Ph.D. degree in Mechanics from Tsinghua University, Beijing, China, in 2018. He is currently a Lecturer with Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology, Beijing, since 2018. His current research interests include the areas of fracture mechanics at elevated temperature as well as reliability and mechanical behavior assessments for materials and structures in electronics packaging. Dr. Dai is also the PI of several scientific research projects supported by academic authorities such as National Natural Science Foundation of China, Beijing Natural Science Foundation and China Postdoctoral Science Foundation.