Current Professional Societies:

1. Members of Technical Subcommittee for Proceedings of the 2018 International Conference on Electronic Packaging Technology (ICEPT 2018);

2. Reviewer of Journal of Electronic Materials, Journal of Materials Science: Materials in Electronics, Journal of Mechanic.

Research Areas:

1. Reliability of power semiconductor device;

2. Thermomechanical modeling;

3. Failure mechanism of electronic packaging;

4. Micro- and macro-mechanical behaviors of packaging materials.

Publications

1. Zhao Jingyi, An Tong*, Fang Chao, Bie Xiaorui, Qin Fei*, Chen Pei, Dai Yanwei. A study on the effect of microstructure evolution of the aluminum metallization layer on its electrical performance during power cycling. IEEE Transaction on Power Electronics, 2019, 34(11): 11036-11045.

2. An Tong, Qin Fei*, Zhou Bin*, Chen Pei, Dai Yanwei, Li Huaicheng, Tang Tao. Vibration lifetime estimation of PBGA solder joints using Steinberg model. Microelectronics Reliability, 2019, 102: 113474.

3. An Tong*, Qin Fei, Chen Si, Chen Pei. The effect of the diffusion creep behavior on the TSV-Cu protrusion morphology during annealing. Journal of Materials Science: Materials in Electronics, 2018, 29(19): 16305-16316.

4. An Tong*, Fang Chao, Qin Fei, Li Huaicheng, Tang Tao, Chen Pei. Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests. Microelectronics Reliability, 2018, 91: 213-226.

5. An Tong*, Qin Fei. Relationship between the intermetallic compounds growth and the microcracking behavior of lead-free solder joints. Transactions of the ASME, Journal of Electronic Packaging, 2016, 138: 011002 (10 pages).

6. Chen Si, An Tong*, Qin Fei, Chen Pei. Microstructure evolution and protrusion of electroplated Cu filled in through silicon vias subjected to thermal cyclic loading. Journal of Electronic Materials, 2017, 46(10): 5916-5932.

7. Wu Wei, Qin Fei, An Tong*, Chen Pei. Experimental and numerical investigation of mechanical properties of electroplating copper filled in through silicon vias. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(1): 23-30.

8. Chen Si, Qin Fei, An Tong*, Wang Ruiming, Zhao Jingyi. Effects of annealing process on microstructure evolution and protrusion of copper filled in through-silicon vias. Acta Metallurgica Sinica, 2016, 52(2): 202-208.

9. Chen Si, Qin Fei*, An Tong*, Chen Pei, Xie Bin, Shi Xunqing. Protrusion of electroplated copper filled in through silicon vias during annealing process. Microelectronics Reliability, 2016, 63: 183-193.

10.Wu Wei, Qin Fei, An Tong*, Chen Pei. A study of creep behavior of TSV-Cu based on nanoindentaion creep test. Journal of Mechanics, 2016, 32(6): 717-724.

11.An Tong, Qin Fei*. Intergranular cracking simulation of the intermetallic compound layer in solder joints. Computational Materials Science, 2013, 79: 1-14.

12.An Tong, Qin Fei*. Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates. Microelectronics Reliability, 2014, 54(5): 932-938.

13.An Tong, Qin Fei*, Xia Guofeng. Analytical solutions and a numerical approach for diffusion-induced stresses in intermetallic compound layers of solder joints. Transactions of the ASME, Journal of Electronic Packaging, 2014, 136: 011001 (8 pages).

14.An Tong, Qin Fei*, Wang Xiaoliang. Microstructure evolution and mechanical behavior of intermetallic compounds in solder joint. Acta Metallurgica Sinica, 2013, 49(9): 1137-1142.

15.An Tong, Qin Fei*, Li Jiangang. Mechanical behavior of solder joints under dynamic four-point impact bending. Microelectronics Reliability, 2011, 51(5): 1011-1019.

16.An Tong, Qin Fei*. Cracking of the intermetallic compound layer in solder joints under drop impact loading. Transactions of the ASME, Journal of Electronic Packaging, 2011, 133(3): 031004 (7 pages).

17.Qin Fei*, An Tong, Chen Na. Strain rate effects and rate-dependent constitutive models of lead-based and lead-free solders. Transactions of the ASME, Journal of Applied Mechanics, 2010, 77(1): 011008 (11 pages).

18.Qin Fei*, An Tong, Chen Na, Bai Jie. Tensile behaviors of lead-containing and lead-free solders at high strain rates. Transactions of the ASME, Journal of Electronic Packaging. 2009, 131(3): 031001 (6 pages).

19.An Tong, Qin Fei*. Cohesive zone modeling of intergranular cracking of intermetallic compounds in solder joints. Lixue Xuebao/ Chinese Journal of Theoretical Applied Mechanics, 2013, 45(6): 936-947. (in Chinese)

20.Qin Fei*, An Tong. Strain rate effects and material models of solders. Lixue Xuebao/ Chinese Journal of Theoretical Applied Mechanics, 2010, 42(3): 439-447. (in Chinese)

21.An Tong, Qin Fei*, Wu Wei, Yu Daquan, Wan Lixi, Wang Jun. Analysis of thermal stress in through silicon via of interposer. Engineering Mechanics, 2013, 30(7): 262-269. (in Chinese)

22.An Tong, Qin Fei*, Wang Xiaoliang. Effect of strain rate on mechanical behavior of lead-free solder joints. Transactions of the China Welding Institution, 2013, 34(10): 59-62. (in Chinese)

23.Qin Fei*, An Tong, Zhong Weixu, Liu Chengyan. Nanoindentation properties of intermetallic compounds in lead-free solder joints. Transactions of the China Welding Institution, 2013, 34(1): 25-28. (in Chinese)

24.Qin, Fei*, An Tong, Xia, Guofeng. Diffusion-induced stress in the intermetallic compound layer of solder joints. Guti Lixue Xuebao/Acta Mechanica Solida Sinica, 2012, 33(2): 162-167. (in Chinese)

25.An Tong, Qin Fei*. Dynamic fracturing of the intermetallic compound layer in solder joints under impact drop loading. Guti Lixue Xuebao/Acta Mechanica Solida Sinica, 2013, 34(2): 117-124. (in Chinese)

26.Qin Fei*, An Tong. Effect of PCB bending stiffness on peeling stress of solder joints in electronics packaging. Journal of Beijing University of Technology, 2008, 34(Supp.): 47-51. (in Chinese)

27.Yuan Xuequan, An Tong*, Qin Fei, Zhao Jingyi, Fang Chao. Mechanisms of power module metallization degradation under ageing. Proceedings of the 2018 International Conference on Electronic Packaging Technology (ICEPT 2018), Shanghai, China, August 8-11, 2018: 1322-1325.

28.Fang Chao, An Tong*, Qin Fei, Zhao Jingyi, Yuan Xuequan. Temperature and stress distribution of IGBT module in DC power cycling test with different switching frequencies. Proceedings of the 2018 International Conference on Electronic Packaging Technology (ICEPT 2018), Shanghai, China, August 8-11, 2018: 785-790. (Best Paper Award)

29.Fang Chao, An Tong*, Qin Fei, Bie Xiaorui, Zhao Jingyi. Study on temperature distribution of IGBT module. Proceedings of the 2017 International Conference on Electronic Packaging Technology (ICEPT 2017), Harbin, China, August 16-19, 2017: 1314-1318.

30.TangTao, An Tong*, Qin Fei. Model simplification method for PBGA assembly simulation under random vibration. Proceedings of the 2016 International Conference on Electronic Packaging Technology (ICEPT 2016), Wuhan, China, August 11-14, 2016: 1226-1229.

31.LI Huaicheng, An Tong*, Tang Tao, Qin Fei. Vibration reliability test and analysis of plastic ball grid array. Proceedings of the 2016 International Conference on Electronic Packaging Technology (ICEPT 2016), Wuhan, China, August 11-14, 2016: 1247-1250.

32.LI Huaicheng, An Tong*, Bie Xiaorui, Shi Ge, Qin Fei. Thermal fatigue reliability analysis of PBGA with Sn63Pb37 solder joints. Proceedings of the 2016 International Conference on Electronic Packaging Technology (ICEPT 2016), Wuhan, China, August 11-14, 2016: 1104-1107.

33.An Tong, Qin Fei*. Numerical simulation of the intermetallic compound cracking in solder joint. Proceedings of the 15th International Conference on Electronic Packaging Technology (ICEPT), Chengdu, China, August 12-15, 2014: 693-697.

34.An Tong, Qin Fei*, Wu Wei, Yu Daquan, Wan Lixi, Wang Jun. An equivalent model of TSV silicon interposer. Proceedings of the 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Guilin, China, August 13-16, 2012: 583-587. (EI 20131416160759)

35.An Tong, Qin Fei*, Wu Wei, Yu Daquan, Wan Lixi, Wang Jun. Effects of via pitch on silicon stress in TSV interposer. Proceedings of the 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Guilin, China, August 13-16, 2012: 600-605.

36.An Tong, Qin Fei*. Fracture simulation of solder joint interface by cohesive zone model. IEEE Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China, August 10-13, 2009: 260-266. (Best Paper Award)

37.An Tong, Qin Fei*. A simplified computational model for solder joints under drop impact loadings. IEEE Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China, August 10-13, 2009: 209-214.

38.An Tong, Qin Fei*. Effects of PCB dynamic responses on solder joint stress. IEEE Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China, August 10-13, 2009: 370-374.

39.An Tong, Qin Fei*, Li Jianggang. Influence of strain rate effect on behavior of solder joints under drop impact loadings. Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China, August 10-13, 2009: 375-378.

40.Qin Fei*, An Tong, Chen Na. Dynamic behavior tests of lead-free solders at high strain rates by the SHPB technique. IEEE Proceedings of 2008 International Conference on Electronic Packaging Technology & High Density Packaging. Shanghai, China, July 28-31, 2008.

41.An Tong, Qin Fei. A scale reduced computation scheme for peeling stress of solder joints under drop impact. IEEE Proceedings of 2008 International Conference on Electronic Packaging Technology & High Density Packaging. Shanghai, China, July 28-31, 2008.

42.Qin Fei, An Tong, Chen Na. Strain rate effect and Johnson-Cook models of lead-free solder alloys. IEEE Proceedings of 2008 International Conference on Electronic Packaging Technology & High Density Packaging. Shanghai, China, July 28-31, 2008. (Best Paper Award)

43.Qin Fei, An Tong, Chen Na. SHPB tests for mechanical behavior of lead-free solder alloys. Proceedings of the International Conference on Experimental Mechanics 2008 & the Seventh Asian Conference on Experimental Mechanics. November 8-11, 2008, Nanjing, China.

44.An Tong, Qin Fei. Fracture simulation of solder joints by a lattice model. IEEE Proceedings of the 8th International Conference on Electronics Packaging Technology (ICEPT), August 14-17, 2007, Shanghai, China. 183-186.

Personal Statement

Tong An received the B.E. degree in safety engineering from Beijing University of Technology, Beijing, China, in 2006, the M.E. degree in solids mechanics from Beijing University of Technology, Beijing, China, in 2009, and Ph.D. degrees in engineering mechanics from the Beijing University of Technology, Beijing, China, 2014.

She is currently an Associate Professor with Institute of Electronics Packaging Technology and Reliability, Beijing University of Technology. Her current research interests include reliability of power semiconductor device, thermomechanical modeling, failure mechanism of electronic packaging, and micro- and macro-mechanical behaviors of packaging materials.