Wang Yishu

Name: Wang Yishu

Gender: Male

Degrees: Ph.D.

Title: Lecturer

E-mail : yishu.wang@bjut.edu.cn

Current Professional Societies

Member of Chinses Materials Youth Society;

Research Areas

1. Reliability of Advanced Electronic Packaging Materials;

2. Directional Separation Technology of Rare and Noble Metals on Waste Circuit Board;

3. Integrated Application Mode of Solid Waste Resource Evaluation Technology.

Publications

1. Yu Tian, Yishu Wang*, Fu Guo, Limin Ma, Jing Han, The Evolution of IMCs in Single Crystal Sn3. 0Ag0. 5Cu and Sn3. 0Ag3. 0Bi3. 0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing, Journal of Electronic Materials, 2019 (5) 48, 2770-2779.

2. Yishu Wang, Minghui Zhang, E. I. Meletis*, On the novel biaxial strain relaxation mechanism in epitaxial composition graded La1-xSrxMnO3 thin film synthesized by RF magnetron sputtering, Coatings, 2015, 5(4): 802-815

Personal Statement

Wang Yishu, Ph.D. in Materials Science and Engineering, lecturer. He obtained his Ph.D. from the University of Texas at Arlington in 2016. Since joining Beijing University of Technology, he has been engaged in the design of environmentally friendly lead-free interconnect materials, the failure mechanism of solder joints and the evaluation of their reliability under the action of complex physics. At the same time, in terms of resource recycling, relevant research was carried out on aspects such as the directional separation technology of rare and precious metals in waste circuit boards and the integrated application model of solid waste resource evaluation technology. Hosted 1 sub-project of the National Key R & D Program, participated in 2 National Key R & D Programs as the backbone of scientific research, and 1 of the Beijing Science and Technology Program, published more than 10 articles.