Current Professional Societies

1. Member of CSTAM

2. Member of Technical Committee, International Conference on Electronic Packaging Technology (ICEPT)

Research Areas

[1] Electronics packaging technology and reliability

[2] Fracture mechanics and structural integrity assessment

[3] Mechanics of advanced materials in electronics packaging

Honors

[1] Selected in Talent Lift Program of Young Scholars by Beijing Association for Science and Technology (2019)

[2] MICOE Aerospace Scholarship, Tsinghua University (2016, 2017)

[3] Excellent paper award, BSTAM (2016)

[4] Kwang-Hua Scholarship, Tsinghua University (2015)

[5] National Scholarship for graduate student (2012)

[6] Outstanding Graduate Award, Wuhan University of Technology (2011)

[7] First Prize, National competition of basic mechanic experiments (2010)

[8] National Scholarship for undergraduate student (2008)

Publications (selected)

[1] YW Dai, Zhi Zan, Shuai Zhao, F Qin. Mode II cohesive zone law of porous sintered silver joints with nickel coated multiwall carbon nanotube additive under ENF test, Theoretical and Applied Fracture Mechanics, 2022, 103498.

[2] Dai YW*, Zan Z, Zhao S, Li Y, Qin F*, Shearing fracture toughness enhancement for sintered silver with nickel coated multiwall carbon nanotubes additive, Engineering Fracture Mechanics, 2022, 260, 108181.

[3] Dai YW, Qin F, Liu YH, Berto F, Chen HF. Characterizations of material constraint effect for creep crack in center weldment under biaxial loading. International Journal of Fracture 2022, 234, 177–193.

[4] Kong WC, Dai YW*, Liu YH*, Out-of-plane effect on the sharp V-notch tip fields in power-law creeping solids: A three-dimensional asymptotic analysis, International Journal of Solids and Structures, 2022, 236–237, 111352.

[5] Zhao S, Dai YW*, Qin F*, Li Y, Liu L, Zan Z, An T, Chen P, Gong Y, Wang Y, On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters, Materials Science & Engineering A, 2021, 823, 141729.

[6] Dai YW, Qin F, Liu YH, Chao YJ. On the second order term asymptotic solution for sharp V-notch tip field in elasto-viscoplastic solids. International Journal of Solids and Structures, 2021, 217–218, 106-122.

[7] Dai YW, Luca Susmel, Qin F. Sharp V-notches in viscoplastic solids: Strain energy rate density rule and fracture toughness. Fatigue & Fracture of Engineering Materials & Structures, 2021; 44:28–42.

[8] Dai YW, Liu YH, Qin F, Chao YJ, Chen HF. Constraint modified time dependent failure assessment diagram (TDFAD) based on C(t)-A2(t) theory for creep crack. International Journal of Mechanical Sciences, 2020, 165, 105193.

[9] Dai YW, Liu YH, Qin F, Chao YJ, Berto F. Estimation of stress field for sharp V-notch in power-law creeping solids: An asymptotic viewpoint. International Journal of Solids and Structures, 2019, 180-181, 189-204.

[10] Dai YW, Zhang M, Qin F, Chen P, An T. Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading. Engineering Fracture Mechanics, 2019, 209, 274-300.

[11] Dai YW, Liu YH, Chao YJ. Higher order asymptotic analysis of crack tip fields under mode II creeping conditions. International Journal of Solids and Structures, 2017, 125, 89-107.

[12] Dai YW, Liu DH, Liu YH. Mismatch constraint effect of creep crack with modified boundary layer model. Journal of Applied Mechanics-Transactions of the ASME, 2016, 83(3), 031008.

Personal statement

Yanwei Dai is currently associate professor, master supervisor with Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing. He has currently authored and coauthored more than 60 peer-reviewed journal and conference papers including more than 50 SCI-indexed journal articles. Dr. Dai is also the principal investigator of several scientific research projects granted by academic authorities such as National Natural Science Foundation of China, Beijing Natural Science Foundation, and China Postdoctoral Science Foundation. Dr. Dai also work with the industrial fields closely on electronics packaging and reliability.