þ Master Supervisor

Research Areas

Highly reliable and environmentally friendly interconnect materials;

Interface material for packaging micro-solder joints;

Electrode interconnects for thermoelectric devices;

Micro-bonding for 3D stacked packaging

Publications

[1] Shuang Liu, Limin Ma*, Zelin Geng, Yuwei Wang, Cheng Zhen, Dan Li, Yishu Wang, Qiang Jia, Fu Guo*, “A strategy to improve the thermal fatigue resistance of solder joints based on amorphous Co-P coating to spontaneously build skeleton of CoSn3 laths”, Materials Characterization, (2024)

[2] Shuang Liu, Limin Ma*, Cheng Zhen, Dan Li, Yishu Wang, Qiang Jia, Fu Guo*, “Surface treatment by crystalline Co-P coating with ultra-thin CoTe2 layer for improved electrical and mechanical properties of the n-type Bi2Te3/Sn TEG electrode”, Applied Surface Science (2024)

[3] Shuang Liu, Limin Ma*, Cheng Zhen, Dan Li, Yishu Wang, Qiang Jia, Fu Guo*, “Microstructural evolution and failure mechanism dominated by Bi, Sb cooperative diffusion at p-type thermoelectric pillar Bi-Sb-Te/Sn interface”, Applied Surface Science, (2023)

[4] Shuang Liu, Limin Ma*, Cheng Zhen, Dan Li, Yishu Wang, Qiang Jia, Fu Guo*, “Enhancing power generation sustainability of thermoelectric pillars by suppressing diffusion at Bi-Sb-Te/Sn electrode interface using crystalline Co-P coatings”, Applied Energy, (2023)

[5] Shuang Liu, Limin Ma*, Cheng Zhen, Dan Li, Yishu Wang, Qiang Jia, Fu Guo*, “Evidences for diffusion-induced phase evolution and crack generation of intermetallic at Bi2Te3/Sn interface of thermoelectric generator electrode”, Materials Characterization (2023)

[6] Shuang Liu, Limin Ma*, Cheng Zhen, Yishu Wang, Dan Li, Fu Guo*, “Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P coatings”, Materials & Design, (2022)

[7] Shuang Liu, Limin Ma*, Cheng Zhen, Yishu Wang, Dan Li, Fu Guo*, “Crystallinity of Co-P coating on microstructure and mechanical properties of Co-Sn intermetallic compounds at Sn-Ag/Co-P/Cu Interface”, Materials Characterization”, 191 (2022)

[8] Shuang Liu, Limin Ma*, Cheng Zhen, Yishu Wang, Dan Li, Fu Guo*, “Microstructural evolution of intermetallic compounds between crystalline/amorphous Cobalt-Phosphorous coatings and lead-free solders”, Journal of Materials Research and Technology, 19(2916-2929 (2022)

[9] Limin Ma, Yong Zuo, Sihan Liu, Fu Guo, Andre Lee, K. N. Subramanian, “Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders”, Journal of Alloys and Compounds, 657(400-407 (2016)

[10] Limin Ma, Yong Zuo, Fu Guo, Yutian Shu, “Effects of current densities on creep behaviors of Sn-3.0Ag-0.5Cu solder joint”, Journal of Materials Research, 29(22), 2738-2747 (2014)

[11] Limin Ma, Yong Zuo, Sihan Liu, Fu Guo*, Xitao Wang, “The failure models of Sn-based solder joints under coupling effects of electromigration and thermal cycling”, Journal of Applied Physics, 113(4), (2013)

[12] Fu Guo, Limin Ma, et al. "Materials Science and Engineering (4th Edition)" [M], (2019) (Translation)

[13] Fu Guo, Limin Ma, et al. "Reliability of Microelectronics Technology—Interconnections, Devices and Systems " [M], (2013) (Translation)

Personal Statement

Prof. Ma Limin, Master Student Supervisor. Since 2012, he has conducted research in teaching and science at the College of Materials Science and Engineering, Beijing University of Technology. The main courses he teaches are Fundamentals of Materials Science, Electronic Packaging Technology and Materials. He has published more than 80 SCI papers, 5 books, and obtained 7 national patent authorizations.